DOLOS Project by NOKIA | World's Way
Back to News

DOLOS Project by NOKIA

A white paper describing the design and implementation of the DOLOS project by NOKIA, a Bell labs subsidiary, was selected as a Top 10 Industry Paper for the upcoming symposiums hosted by Radio Frequency Integrated Circuits (RFIC) and IMS Global Learning Consortium (IMS).  In support of the DOLOS project, WORLD electronics assembled the DOLOS breakout board.  The board has a 5G ultra-high speed RF wireless design utilizing multiple 3.5mil BGA placements and required rigorous testing.  WORLD electronics is proud to support this project and once again achieve and surpass customer expectations. Read the complete white paper here.

 

Related Articles

SMT, Thru Hole, Mixed Technology

Box Build/Higher Level Assembly

Printed Circuit Board Design and Layout

Engineering Service

Test Development

Supply Chain Management

In-Circuit Testing

New Product Introduction

PCB Solder Paste Inspection Techniques

Functional Testing

Burn-in and Temperature Cycling

WORLD and Our Clients

Find Your Solution

Whether it's about a job we have in-house or an idea you've been thinking about, you can send us questions or comments at any time of the day or night.