Contract Manufacturing

COB, Wire Bonding, MCM, FlipChip

WORLD electronics commitment to innovation parallel’s our customers need to stay ahead of the competition. We work with our suppliers and customers to qualify assembly and test methods for new electronic component packages as well as anticipate technology trends that will improve our manufacturing processes.

Technologies and Capabilities Include:

  • Class 10,000 cleanroom
  • COB and MCM
  • Epoxy die attach
  • Gold and aluminum wedge bonding
  • Wire bonding
  • Encapsulation, glob top
  • Dam and fill process
  • Thin or thick film substrate
  • Plasma cleaning
  • Wire pull test
  • Die and ball shear test